Electronic Component Protection Non Silicone Release Film 25μm

PET/PI/OPP substrate coated with a layer of non-silicon release material, the product is mainly used in FPC/PCB process, TPU casting protection, silicone protective film and new energy electronics industry.

• Produced in 1000-level clean environment with high cleanness
• Film surface has no obvious coating lines, release force is stable and easy to peel off
• High residual adhesion rate (≥85%), silicon-free migration, no performance impact on bonding material, non-polluting
• Adjustable Release Force: Offers customizable release force (light to heavy) to match adhesive requirements
• Electronics Manufacturing: Avoids silicon contamination in FPC/PCB production and OLED screen lamination
• Anti-Static Properties: Protects electronic components from static damage during handling and transport

• Medical Device Packaging: Ensures sterility and biocompatibility for surgical tools and implants
• Adhesive Medical Products: Serves as a carrier for transdermal patches to maintain adhesive integrity

• Flexible Printed Circuits (FPC/PCB): Protective layer during copper foil lamination and circuit etching
• Display Manufacturing: Applied in LCD/OLED production for residue-free separation
• Electronic Component Protection: Shields capacitors, resistors, and semiconductors from contamination

• Lithium-Ion Batteries: Protects battery separators and electrodes during high-temperature processes
• Ceramic/Carbon Fiber Composites: Acts as a release layer ensuring smooth demolding

• Generally packaged in cardboard tray or nude tray packaging
• All cartons include certificate and packing list, each tray has product list
• Custom packaging available according to user requirements